Assignee
KURIMURA HIROYUKI
JP·10 granted patents·7 citations·filing 2010–2012
Top patents by PatentIndex Score
10 records- 0182US9067398B2Method for disassembling bonded body, and adhesiveKURIMURA HIROYUKI·Filed 2011·Granted Jun 30, 2015·3 cites·16 claims
- 0271US8673105B2Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatusKURIMURA HIROYUKI·Filed 2012·Granted Mar 18, 2014·3 cites·20 claims
- 0369US9061485B2Method of manufacturing translucent rigid substrate laminateKURIMURA HIROYUKI·Filed 2011·Granted Jun 23, 2015·1 cites·15 claims
- 0457US9718996B2Composition and method for temporarily fixing member using sameKURIMURA HIROYUKI·Filed 2012·Granted Aug 1, 2017·0 cites·27 claims
- 0554US8901192B2(Meth)acrylic resin compositionKURIMURA HIROYUKI·Filed 2010·Granted Dec 2, 2014·0 cites·15 claims
- 0649US9381727B2Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatusKURIMURA HIROYUKI·Filed 2012·Granted Jul 5, 2016·0 cites·21 claims
- 0744US9358763B2Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatusKURIMURA HIROYUKI·Filed 2012·Granted Jun 7, 2016·0 cites·11 claims
- 0844US9242442B2Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatusKURIMURA HIROYUKI·Filed 2011·Granted Jan 26, 2016·0 cites·16 claims
- 0944US9023173B2Method of processing translucent rigid substrate laminate, and process of manufacturing plate-shaped product employing the methodKURIMURA HIROYUKI·Filed 2011·Granted May 5, 2015·0 cites·20 claims
- 1042US9227385B2Method for processing transluscent rigid substrate laminate and method for manufacturing plate shaped productKURIMURA HIROYUKI·Filed 2011·Granted Jan 5, 2016·0 cites·17 claims
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