Assignee
KURODA HIROFUMI
JP·2 granted patents·2 citations·filing 2008–2010
Top patents by PatentIndex Score
2 records- 0155US8138266B2Semiconductor-encapsulating resin composition and semiconductor deviceKURODA HIROFUMI·Filed 2008·Granted Mar 20, 2012·2 cites·19 claims
- 0241US8124695B2Resin composition for semiconductor encapsulation and semiconductor deviceKURODA HIROFUMI·Filed 2010·Granted Feb 28, 2012·0 cites·15 claims
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