Assignee
KURODA NAOTAKA
JP·2 granted patents·4 citations·filing 2007–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0167US8063484B2Semiconductor device and heat sink with 3-dimensional thermal conductivityKURODA NAOTAKA·Filed 2007·Granted Nov 22, 2011·4 cites·9 claims
- 0244US8476756B2Semiconductor device and heat sink with 3-dimensional thermal conductivityKURODA NAOTAKA·Filed 2011·Granted Jul 2, 2013·0 cites·11 claims
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