Assignee
LAI CHIEH-LUNG
TW·1 granted patent·2 pending applications·9 citations·filing 2011–2011
Top patents by PatentIndex Score
3 records- 0179US8471284B2LED package structure and fabrication method thereofLAI CHIEH-LUNG·Filed 2011·Granted Jun 25, 2013·9 cites·10 claims
- 0231US2012286308A1Led package structure and method of fabricating the sameLAI CHIEH-LUNG·Filed 2011·Application pending·0 cites
- 0330US2012127693A1Light-permeating cover board, method of fabricating the same, and package having the sameLAI CHIEH-LUNG·Filed 2011·Application pending·0 cites
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