Assignee
LAI CHIEN-KUANG
TW·1 granted patent·1 pending application·7 citations·filing 2012–2012
Top patents by PatentIndex Score
2 records- 0176US8610250B2Packaging substrate having embedded capacitors and fabrication method thereofLAI CHIEN-KUANG·Filed 2012·Granted Dec 17, 2013·7 cites·9 claims
- 0221US2012314377A1Packaging structure embedded with electronic elements and method of fabricating the sameLAI CHIEN-KUANG·Filed 2012·Application pending·0 cites
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