Assignee
LAKE RICKIE C
US·3 granted patents·2 pending applications·94 citations·filing 2007–2012
Top patents by PatentIndex Score
5 records- 0197US8183151B2Methods of forming conductive vias through substrates, and structures and assemblies resulting therefromLAKE RICKIE C·Filed 2007·Granted May 22, 2012·92 cites·20 claims
- 0271US8415233B2Wafer processingLAKE RICKIE C·Filed 2011·Granted Apr 9, 2013·2 cites·10 claims
- 0360US2008291027A1Thin Profile Battery Bonding Method, Method Of Conductively Interconnecting Electronic Components, Battery Powerable Apparatus, Radio Frequency Communication Device, And Electric CircuitLAKE RICKIE C·Filed 2007·Application pending·0 cites
- 0453US8835293B2Methods for forming conductive elements and vias on substratesLAKE RICKIE C·Filed 2012·Granted Sep 16, 2014·0 cites·18 claims
- 0538US2012186741A1Apparatus for wafer-to-wafer bondingLAKE RICKIE C·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →