Assignee
LAM KEN
US·5 granted patents·8 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0177US8455304B2Routable array metal integrated circuit package fabricated using partial etching processLAM KEN·Filed 2010·Granted Jun 4, 2013·4 cites·20 claims
- 0268US8324023B2Stacked-die electronics package with planar and three-dimensional inductor elementsLAM KEN·Filed 2011·Granted Dec 4, 2012·2 cites·17 claims
- 0362US8487424B2Routable array metal integrated circuit package fabricated using partial etching processLAM KEN·Filed 2012·Granted Jul 16, 2013·1 cites·6 claims
- 0458US8174099B2Leadless package with internally extended package leadsLAM KEN·Filed 2008·Granted May 8, 2012·1 cites·9 claims
- 0553US8237266B2Component stacking for integrated circuit electronic packageLAM KEN·Filed 2008·Granted Aug 7, 2012·0 cites·16 claims
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