Assignee
LAM KUI KAM
HK·4 granted patents·3 pending applications·2 citations·filing 2010–2014
Top patents by PatentIndex Score
7 records- 0161US10399170B2Die attachment apparatus and method utilizing activated forming gasLAM KUI KAM·Filed 2013·Granted Sep 3, 2019·2 cites·18 claims
- 0240US2013119113A1System for dispensing soft solder for mounting semiconductor chips using multiple solder wiresLAM KUI KAM·Filed 2013·Application pending·0 cites
- 0340US2014341691A1Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bondingLAM KUI KAM·Filed 2014·Application pending·0 cites
- 0439US8956892B2Method and apparatus for fabricating a light-emitting diode packageLAM KUI KAM·Filed 2012·Granted Feb 17, 2015·0 cites·18 claims
- 0537US8804136B2Apparatus and method for locating a plurality of placement positions on a carrier objectLAM KUI KAM·Filed 2012·Granted Aug 12, 2014·0 cites·19 claims
- 0635US8590143B2Apparatus for delivering semiconductor components to a substrateLAM KUI KAM·Filed 2011·Granted Nov 26, 2013·0 cites·8 claims
- 0735US2011272452A1System for dispensing soft solder for mounting semiconductor chips using multiple solder wiresLAM KUI KAM·Filed 2010·Application pending·0 cites
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