Assignee

LAPIS SEMICONDUTOR CO LTD

JP·2 granted patents·0 citations·filing 2013–2015

Technology mixH01L2 H10W2

Top patents by PatentIndex Score

2 records

0149US9293402B2Device with pillar-shaped componentsLAPIS SEMICONDUTOR CO LTD·Filed 2013·Granted Mar 22, 2016·0 cites·14 claims
0248US9721879B2Device with pillar-shaped componentsLAPIS SEMICONDUTOR CO LTD·Filed 2015·Granted Aug 1, 2017·0 cites·6 claims

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