Assignee
LEADING INTERCONNECT SEMICONDUCTOR TECH QINHUANGDAO CO LTD
CN·2 granted patents·0 citations·filing 2021–2023
Technology mixH05K2
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2 records- 0170US12418989B2Packaged circuit structureLEADING INTERCONNECT SEMICONDUCTOR TECH QINHUANGDAO CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·8 claims
- 0261US11683888B2Method for manufacturing a packaged circuit structureLEADING INTERCONNECT SEMICONDUCTOR TECH QINHUANGDAO CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·11 claims
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