Assignee
LEARONAL JAPAN INC
JP·3 granted patents·128 citations·filing 1992–1999
Top patents by PatentIndex Score
3 records- 0186US5454930AElectrolytic copper plating using a reducing agentLEARONAL JAPAN INC·Filed 1994·Granted Oct 3, 1995·41 cites·3 claims
- 0281US6287371B1Non-electrolytic gold plating liquid and non-electrolytic gold plating method using sameLEARONAL JAPAN INC·Filed 1999·Granted Sep 11, 2001·62 cites·15 claims
- 0363US5302256AImmersion tin/lead alloy plating bathLEARONAL JAPAN INC·Filed 1992·Granted Apr 12, 1994·25 cites·11 claims
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