Assignee
LEE BO YOUNG
6 granted patents·2 pending applications·39 citations·filing 2005–2018
Top patents by PatentIndex Score
8 records- 0193US8883611B2Methods of fabricating semiconductor devices having air gaps in dielectric layersLEE BO-YOUNG·Filed 2012·Granted Nov 11, 2014·18 cites·18 claims
- 0280US8536652B2Non-volatile memory devices including low-K dielectric gaps in substratesLEE BO-YOUNG·Filed 2011·Granted Sep 17, 2013·5 cites·6 claims
- 0379US9196630B2Semiconductor devices having carbon-contained porous insulation over gate stack structuresLEE BO-YOUNG·Filed 2014·Granted Nov 24, 2015·4 cites·5 claims
- 0477US7559251B2Apparatus for forming thermal fatigue cracksLEE BO-YOUNG·Filed 2007·Granted Jul 14, 2009·9 cites·3 claims
- 0574US9040378B2Methods of forming semiconductor devices including vertical channels and semiconductor devices formed using such methodsLEE BO-YOUNG·Filed 2014·Granted May 26, 2015·3 cites·20 claims
- 0648US2021284367A1Seal packaging machine for food containerLEE BO YOUNG·Filed 2018·Application pending·0 cites
- 0747US8270556B2Apparatus for forming stress corrosion cracksLEE BO YOUNG·Filed 2008·Granted Sep 18, 2012·0 cites·5 claims
- 0839US2007262075A1Heat Plate for Welding the Pipe with Multi-Walls and the Method for Welding the SameLEE BO-YOUNG·Filed 2005·Application pending·0 cites
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