Assignee
LEE BYUNG-WOO
KR·1 granted patent·3 pending applications·1 citations·filing 2012–2016
Top patents by PatentIndex Score
4 records- 0153US9607950B2Package substrate and semiconductor package including the sameLEE BYUNG WOO·Filed 2014·Granted Mar 28, 2017·1 cites·15 claims
- 0242US2014124910A1Semiconductor package and method of forming the sameLEE BYUNG-WOO·Filed 2013·Application pending·0 cites
- 0337US2016211236A1Semiconductor package and method of forming the sameLEE BYUNG-WOO·Filed 2016·Application pending·0 cites
- 0437US2014143987A1Unit and zipper device for blocking harmful insectsLEE BYUNG-WOO·Filed 2012·Application pending·0 cites
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