Assignee

LEE CHEONHEE

KR·2 granted patents·10 citations·filing 2005–2009

Technology mixH10W2

Top patents by PatentIndex Score

2 records

0178US8067823B2Chip scale package having flip chip interconnect on die paddleLEE CHEONHEE·Filed 2005·Granted Nov 29, 2011·10 cites·18 claims
0248US8174120B2Integrated circuit package system with leadframe substrateLEE CHEONHEE·Filed 2009·Granted May 8, 2012·0 cites·6 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →