Assignee
LEE CHUN
US·4 granted patents·10 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0175US8546504B2Extrusion processes using high melt strength polypropyleneLEE CHUN·Filed 2011·Granted Oct 1, 2013·2 cites·14 claims
- 0269US8169351B2Feedback circuits with DC offset cancellationLEE CHUN·Filed 2009·Granted May 1, 2012·7 cites·25 claims
- 0365US8389632B2Co-continuous heterophase polymer compositions containing high melt strength polypropylene for extrusion coatingLEE CHUN·Filed 2011·Granted Mar 5, 2013·1 cites·20 claims
- 0454US8575252B2Controlled rheology formulations containing high melt strength polypropylene for extrusion coatingLEE CHUN·Filed 2011·Granted Nov 5, 2013·0 cites·15 claims
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