Assignee

LEE DOHYUN

KR·2 granted patents·9 citations·filing 2016–2017

Technology mixH01L2 H10B2 H10W2

Top patents by PatentIndex Score

2 records

0190US9875931B2Semiconductor device having interconnection structureLEE DOHYUN·Filed 2016·Granted Jan 23, 2018·7 cites·11 claims
0279US10418278B2Semiconductor device having interconnection structureLEE DOHYUN·Filed 2017·Granted Sep 17, 2019·2 cites·20 claims

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