Assignee
LEE HUN TEAK
KR·7 granted patents·17 citations·filing 2006–2015
Top patents by PatentIndex Score
7 records- 0176US8129263B2Wire bond interconnection and method of manufacture thereofLEE HUN-TEAK·Filed 2011·Granted Mar 6, 2012·3 cites·16 claims
- 0275US8304874B2Stackable integrated circuit package systemLEE HUN TEAK·Filed 2006·Granted Nov 6, 2012·6 cites·20 claims
- 0372US9129826B2Epoxy bump for overhang dieLEE HUN TEAK·Filed 2006·Granted Sep 8, 2015·6 cites·17 claims
- 0469US9385100B1Integrated circuit packaging system with surface treatment and method of manufacture thereofLEE HUN TEAK·Filed 2015·Granted Jul 5, 2016·2 cites·14 claims
- 0549US8256660B2Semiconductor package system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Sep 4, 2012·0 cites·21 claims
- 0645US8519517B2Semiconductor system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Aug 27, 2013·0 cites·10 claims
- 0740US8716108B2Integrated circuit packaging system with ultra-thin chip and method of manufacture thereofLEE HUN TEAK·Filed 2012·Granted May 6, 2014·0 cites·14 claims
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