Assignee
LEE JAE HAK
KR·6 granted patents·2 pending applications·34 citations·filing 2009–2013
Top patents by PatentIndex Score
8 records- 0186US9547023B2Test probe for test and fabrication method thereofLEE JAE HAK·Filed 2011·Granted Jan 17, 2017·9 cites·17 claims
- 0283US8513061B2Method of fabricating a TSV for 3D packaging of semiconductor deviceLEE JAE-HAK·Filed 2011·Granted Aug 20, 2013·8 cites·9 claims
- 0382US8727328B2Insert for handlerLEE JAE HAK·Filed 2010·Granted May 20, 2014·5 cites·6 claims
- 0473US8610447B2Spring structure and test socket using thereofLEE JAE HAK·Filed 2009·Granted Dec 17, 2013·11 cites·14 claims
- 0559US8722513B2Semiconductor chip stack package and manufacturing method thereofLEE JAE-HAK·Filed 2011·Granted May 13, 2014·1 cites·8 claims
- 0649US2011102009A1Test socket electrical connector, and method for manufacturing the test socketLEE JAE HAK·Filed 2009·Application pending·0 cites
- 0748US8702269B2Outdoor lampLEE JAE HAK·Filed 2010·Granted Apr 22, 2014·0 cites·13 claims
- 0845US2014028339A1Spring assembly and test socket using the sameLEE JAE HAK·Filed 2013·Application pending·0 cites
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