Assignee
LEE JONG GI
KR·4 granted patents·13 citations·filing 2011–2017
Top patents by PatentIndex Score
4 records- 0186US8772084B2Multi-chip semiconductor package and method of fabricating the sameLEE JONG-GI·Filed 2012·Granted Jul 8, 2014·9 cites·20 claims
- 0277US8288210B2Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor packageLEE JONG-GI·Filed 2011·Granted Oct 16, 2012·4 cites·13 claims
- 0350US8664762B2Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor packageLEE JONG-GI·Filed 2012·Granted Mar 4, 2014·0 cites·9 claims
- 0444US10257605B2Earphone protection deviceLEE JONG GI·Filed 2017·Granted Apr 9, 2019·0 cites·5 claims
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