Assignee
LEE KUO-YUAN
TW·3 granted patents·5 pending applications·13 citations·filing 2009–2012
Top patents by PatentIndex Score
8 records- 0182US8093104B1Multi-chip stacking method to reduce voids between stacked chipsLEE KUO-YUAN·Filed 2011·Granted Jan 10, 2012·9 cites·17 claims
- 0271US8112854B2Tool holding device for a five-axis latheLEE KUO-YUAN·Filed 2010·Granted Feb 14, 2012·3 cites·5 claims
- 0356US8815645B2Multi-chip stacking method to reduce voids between stacked chipsLEE KUO-YUAN·Filed 2011·Granted Aug 26, 2014·1 cites·15 claims
- 0452US2013266923A1Interactive Multimedia Instructional System and DeviceLEE KUO-YUAN·Filed 2012·Application pending·0 cites
- 0543US2010219521A1Window type semiconductor packageLEE KUO-YUAN·Filed 2009·Application pending·0 cites
- 0636US2012187598A1Method and apparatus of compression molding to reduce voids in molding compounds of semiconductor packagesLEE KUO-YUAN·Filed 2011·Application pending·0 cites
- 0734US2012077312A1Flip-chip bonding method to reduce voids in underfill materialLEE KUO-YUAN·Filed 2011·Application pending·0 cites
- 0834US2012264257A1Mold array process method to prevent exposure of substrate peripheriesLEE KUO-YUAN·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →