Assignee
LEE KYU WON
KR·3 granted patents·1 pending application·32 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0192US8564141B2Chip unit and stack package having the sameLEE KYU WON·Filed 2011·Granted Oct 22, 2013·32 cites·16 claims
- 0248US8461696B2Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor packageLEE KYU WON·Filed 2009·Granted Jun 11, 2013·0 cites·18 claims
- 0344US8476751B2Stacked semiconductor package and method for manufacturing the sameLEE KYU WON·Filed 2011·Granted Jul 2, 2013·0 cites·13 claims
- 0439US2012207971A1Buffer substrate, buffer sheet and manufacturing method thereofLEE KYU WON·Filed 2012·Application pending·0 cites
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