Assignee
LEE LEE HAN MENG@EUGENE
MY·5 granted patents·2 pending applications·10 citations·filing 2009–2017
Top patents by PatentIndex Score
7 records- 0169US8203199B2Tie bar and mold cavity bar arrangements for multiple leadframe stack packageLEE LEE HAN MENG EUGENE·Filed 2009·Granted Jun 19, 2012·6 cites·18 claims
- 0259US8779566B2Flexible routing for high current module applicationLEE LEE HAN MENG EUGENE·Filed 2011·Granted Jul 15, 2014·2 cites·10 claims
- 0358US8105063B1Three piece mold cavity design for packaging integrated circuitsLEE LEE HAN MENG EUGENE·Filed 2010·Granted Jan 31, 2012·1 cites·11 claims
- 0452US8304887B2Module package with embedded substrate and leadframeLEE LEE HAN MENG EUGENE·Filed 2009·Granted Nov 6, 2012·1 cites·13 claims
- 0547US2018122724A1Semiconductor Device Having Leadframe With Pressure-Absorbing Pad StrapsLEE LEE HAN MENG@EUGENE·Filed 2017·Application pending·0 cites
- 0629US2013127029A1Two level leadframe with upset ball bonding surface and device packageLEE LEE HAN MENG EUGENE·Filed 2011·Application pending·0 cites
- 0724US8847370B2Exposed die package that helps protect the exposed die from damageLEE LEE HAN MENG EUGENE·Filed 2011·Granted Sep 30, 2014·0 cites·6 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →