Assignee
LEE MICHAEL G
US·3 granted patents·1 pending application·14 citations·filing 2007–2011
Top patents by PatentIndex Score
4 records- 0180US8487428B2Method and system for providing a reliable semiconductor assemblyLEE MICHAEL G·Filed 2007·Granted Jul 16, 2013·10 cites·22 claims
- 0272US8236606B2Method and system for providing a low-profile semiconductor assemblyLEE MICHAEL G·Filed 2010·Granted Aug 7, 2012·3 cites·10 claims
- 0358US8633592B2Hybrid interconnect technologyLEE MICHAEL G·Filed 2011·Granted Jan 21, 2014·1 cites·13 claims
- 0435US2012032327A1Systems and methods for reinforcing chip packagesLEE MICHAEL G·Filed 2010·Application pending·0 cites
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