Assignee
LEE SANGDO
CN·1 granted patent·2 pending applications·2 citations·filing 2007–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0148US8084870B2Semiconductor devices and electrical parts manufacturing using metal coated wiresLEE SANGDO·Filed 2007·Granted Dec 27, 2011·2 cites·5 claims
- 0233US2007222087A1Semiconductor device with solderable loop contactsLEE SANGDO·Filed 2007·Application pending·0 cites
- 0332US2012146204A1Semiconductor devices and electrical parts manufacturing using metal coated wiresLEE SANGDO·Filed 2011·Application pending·0 cites
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