Assignee
LEE SOO WON
KR·1 granted patent·1 pending application·0 citations·filing 2010–2012
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0138US2013249076A1Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent TracesLEE SOO WON·Filed 2012·Application pending·0 cites
- 0233US8709932B2Integrated circuit packaging system with interconnects and method of manufacture thereofLEE SOO WON·Filed 2010·Granted Apr 29, 2014·0 cites·20 claims
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