Assignee
LEE SUK WON
KR·1 granted patent·2 pending applications·1 citations·filing 2005–2011
Top patents by PatentIndex Score
3 records- 0160US8418361B2Method of manufacturing printed circuit board having landless via holeLEE SUK WON·Filed 2011·Granted Apr 16, 2013·1 cites·5 claims
- 0235US2012152753A1Method of manufacturing printed circuit boardLEE SUK WON·Filed 2011·Application pending·0 cites
- 0326US2006006341A1Stage apparatusLEE SUK-WON·Filed 2005·Application pending·0 cites
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