Assignee
LEE TAEWOO
KR·2 granted patents·1 pending application·6 citations·filing 2007–2012
Top patents by PatentIndex Score
3 records- 0176US8258008B2Package-on-package system with via z-interconnections and method for manufacturing thereofLEE TAEWOO·Filed 2010·Granted Sep 4, 2012·4 cites·17 claims
- 0260US8676422B2Creep control device and method for hybrid vehicleLEE TAEWOO·Filed 2012·Granted Mar 18, 2014·2 cites·12 claims
- 0343US2009140408A1Integrated circuit package-on-package system with stacking via interconnectLEE TAEWOO·Filed 2007·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →