Assignee
LEE TEAK-HOON
KR·2 granted patents·1 pending application·32 citations·filing 2009–2013
Top patents by PatentIndex Score
3 records- 0193US8455301B2Method of fabricating stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2011·Granted Jun 4, 2013·25 cites·26 claims
- 0284US8637969B2Stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2013·Granted Jan 28, 2014·7 cites·10 claims
- 0352US2009298234A1Method of fabricating semiconductor chip package, semiconductor wafer, and method of sawing the semiconductor waferLEE TEAK-HOON·Filed 2009·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →