Assignee
LEI WEISHENG
US·4 granted patents·62 citations·filing 2007–2009
Top patents by PatentIndex Score
4 records- 0194US8710402B2Method of and apparatus for laser drilling holes with improved taperLEI WEISHENG·Filed 2007·Granted Apr 29, 2014·33 cites·20 claims
- 0287US8116341B2Multiple laser wavelength and pulse width process drillingLEI WEISHENG·Filed 2007·Granted Feb 14, 2012·13 cites·11 claims
- 0385US9346130B2Method for laser processing glass with a chamfered edgeLEI WEISHENG·Filed 2008·Granted May 24, 2016·12 cites·45 claims
- 0476US8415586B2Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulsesLEI WEISHENG·Filed 2009·Granted Apr 9, 2013·4 cites·22 claims
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