Assignee
LEUNG MICHAEL S
US·3 granted patents·8 citations·filing 2009–2011
Top patents by PatentIndex Score
3 records- 0184US9093616B2Molded chip fabrication method and apparatusLEUNG MICHAEL S·Filed 2011·Granted Jul 28, 2015·5 cites·26 claims
- 0278US10164158B2Molded chip fabrication method and apparatusLEUNG MICHAEL S·Filed 2010·Granted Dec 25, 2018·3 cites·10 claims
- 0354US10546978B2Molded chip fabrication method and apparatusLEUNG MICHAEL S·Filed 2009·Granted Jan 28, 2020·0 cites·39 claims
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