Assignee
LEXVU OPTO MICROELECTRONICS TECHNOLOGY SHANGHAI LTD
CN·3 granted patents·20 citations·filing 2013–2013
Top patents by PatentIndex Score
3 records- 0190US8802541B2Method for low temperature wafer bonding and bonded structureLEXVU OPTO MICROELECTRONICS TECHNOLOGY SHANGHAI LTD·Filed 2013·Granted Aug 12, 2014·15 cites·14 claims
- 0286US8945967B2Photosensitive imaging device and method for forming semiconductor deviceLEXVU OPTO MICROELECTRONICS TECHNOLOGY SHANGHAI LTD·Filed 2013·Granted Feb 3, 2015·5 cites·17 claims
- 0343US8907434B2MEMS inertial sensor and method for manufacturing the sameLEXVU OPTO MICROELECTRONICS TECHNOLOGY SHANGHAI LTD·Filed 2013·Granted Dec 9, 2014·0 cites·20 claims
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