Assignee

LI ERIC J

US·2 granted patents·11 citations·filing 2010–2011

Technology mixH10P2 H10W2 B32B1 H01L1

Top patents by PatentIndex Score

2 records

0186US8193072B2Semiconductor wafer coat layers and methods thereforLI ERIC J·Filed 2010·Granted Jun 5, 2012·9 cites·9 claims
0270US9390968B2Low temperature thin wafer backside vacuum process with backgrinding tapeLI ERIC J·Filed 2011·Granted Jul 12, 2016·2 cites·19 claims

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