Assignee
LIANG SHIH-WEI
TW·3 granted patents·25 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0195US8581400B2Post-passivation interconnect structureLIANG SHIH-WEI·Filed 2011·Granted Nov 12, 2013·22 cites·20 claims
- 0265US9646954B2Integrated circuit with test circuitLIANG SHIH-WEI·Filed 2011·Granted May 9, 2017·2 cites·20 claims
- 0362US8664768B2Interposer having a defined through via patternLIANG SHIH-WEI·Filed 2012·Granted Mar 4, 2014·1 cites·20 claims
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