Assignee
LIEU PETER
US·2 granted patents·1 pending application·2 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0155US8586407B2Method for depackaging prepackaged integrated circuit die and a product from the methodLIEU PETER·Filed 2011·Granted Nov 19, 2013·2 cites·19 claims
- 0232US8609473B2Method for fabricating a neo-layer using stud bumped bare dieLIEU PETER·Filed 2011·Granted Dec 17, 2013·0 cites·1 claims
- 0331US2012211886A1Method for Fabricating a Small Footprint Chip-Scale Package and a Device Made from the MethodLIEU PETER·Filed 2012·Application pending·0 cites
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