Assignee
LIM KEN BENG
MY·3 granted patents·19 citations·filing 2009–2010
Top patents by PatentIndex Score
3 records- 0188US8598698B1Package substrate with an embedded stiffenerLIM KEN BENG·Filed 2010·Granted Dec 3, 2013·17 cites·20 claims
- 0261US9054077B2Package having spaced apart heat sinkLIM KEN BENG·Filed 2010·Granted Jun 9, 2015·2 cites·19 claims
- 0343US9076776B1Integrated circuit package with stand-off legsLIM KEN BENG·Filed 2009·Granted Jul 7, 2015·0 cites·18 claims
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