Assignee
LIM THIAM B
SG·2 granted patents·89 citations·filing 1991–1991
Top patents by PatentIndex Score
2 records- 0184US5227232AConductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distributionLIM THIAM B·Filed 1991·Granted Jul 13, 1993·80 cites·5 claims
- 0236US5146312AInsulated lead frame for semiconductor packaged devicesLIM THIAM B·Filed 1991·Granted Sep 8, 1992·9 cites·4 claims
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