Assignee

LIN CHEN-HAN

TW·2 granted patents·9 citations·filing 2011–2011

Technology mixB81C2 B81B1 H10W1

Top patents by PatentIndex Score

2 records

0185US8399940B2Package structure having MEMS elements and fabrication method thereofLIN CHEN-HAN·Filed 2011·Granted Mar 19, 2013·8 cites·24 claims
0255US8633048B2Method for fabricating package structure having MEMS elementsLIN CHEN-HAN·Filed 2011·Granted Jan 21, 2014·1 cites·16 claims

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