Assignee
LIN PANG-CHUN
TW·5 granted patents·10 citations·filing 2010–2012
Top patents by PatentIndex Score
5 records- 0181US8304268B2Fabrication method of semiconductor package structureLIN PANG-CHUN·Filed 2010·Granted Nov 6, 2012·5 cites·22 claims
- 0269US8421199B2Semiconductor package structureLIN PANG-CHUN·Filed 2010·Granted Apr 16, 2013·2 cites·8 claims
- 0369US8390118B2Semiconductor package having electrical connecting structures and fabrication method thereofLIN PANG-CHUN·Filed 2010·Granted Mar 5, 2013·2 cites·9 claims
- 0460US8525336B2Semiconductor package and method of fabricating the sameLIN PANG-CHUN·Filed 2012·Granted Sep 3, 2013·1 cites·5 claims
- 0544US8873244B2Package structureLIN PANG-CHUN·Filed 2010·Granted Oct 28, 2014·0 cites·22 claims
Join the waitlist — get patent alerts
Get an alert when LIN PANG-CHUN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →