Assignee
LIN SHEN-BO
TW·2 granted patents·6 pending applications·1 citations·filing 2010–2011
Top patents by PatentIndex Score
8 records- 0153US8492790B2LED package with bounding dam surrounding LED chip and thermoset encapsulation enclosing LED chip and method for manufacturing the sameLIN SHEN-BO·Filed 2011·Granted Jul 23, 2013·1 cites·18 claims
- 0242US2012021541A1Light emitting device and method of fabricating the sameLIN SHEN BO·Filed 2011·Application pending·0 cites
- 0334US2012025240A1Package of light emitting device and method of manufacturing the sameLIN SHEN-BO·Filed 2011·Application pending·0 cites
- 0434US2012025238A1Led packageLIN SHEN-BO·Filed 2010·Application pending·0 cites
- 0533US8143080B2Method for manufacturing LED package and substrate thereofLIN SHEN-BO·Filed 2010·Granted Mar 27, 2012·0 cites·15 claims
- 0630US2012021542A1Method of packaging light emitting deviceLIN SHEN-BO·Filed 2011·Application pending·0 cites
- 0730US2012012873A1Light emitting diode package for microminiaturizationLIN SHEN-BO·Filed 2011·Application pending·0 cites
- 0830US2012034716A1Method for manufacturing light emitting diodeLIN SHEN-BO·Filed 2011·Application pending·0 cites
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