Assignee
LINDNER FRIEDRICH PAUL
AT·5 granted patents·7 citations·filing 2008–2011
Top patents by PatentIndex Score
5 records- 0179US8894807B2Device and method for detaching a semiconductor wafer from a substrateLINDNER FRIEDRICH PAUL·Filed 2010·Granted Nov 25, 2014·3 cites·13 claims
- 0272US9116424B2Device for embossing of substratesLINDNER FRIEDRICH PAUL·Filed 2010·Granted Aug 25, 2015·2 cites·12 claims
- 0358US8763239B2System for uniform structuring of substratesLINDNER FRIEDRICH PAUL·Filed 2008·Granted Jul 1, 2014·2 cites·20 claims
- 0442US8931624B2Transport system for accommodating and transporting flexible substratesLINDNER FRIEDRICH PAUL·Filed 2010·Granted Jan 13, 2015·0 cites·12 claims
- 0540US9751698B2Device and method for processing wafersLINDNER FRIEDRICH PAUL·Filed 2011·Granted Sep 5, 2017·0 cites·18 claims
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