Assignee
LINGSEN PREC INDUSTRIES LTD
TW·13 granted patents·5 pending applications·2 citations·filing 2014–2023
Top patents by PatentIndex Score
18 records- 0169US10696543B1Waterproof MEMS chip package structureLINGSEN PREC INDUSTRIES LTD·Filed 2019·Granted Jun 30, 2020·1 cites·5 claims
- 0259US2025015036A1Preformed unit of fan-out chip-embedded packaging process and application manufacturing method thereofLINGSEN PREC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0358US11041774B2Pressure sensor packageLINGSEN PREC INDUSTRIES LTD·Filed 2018·Granted Jun 22, 2021·1 cites·7 claims
- 0456US11410856B2Chip packaging methodLINGSEN PREC INDUSTRIES LTD·Filed 2020·Granted Aug 9, 2022·0 cites·3 claims
- 0551US10396234B2Package structure of long-distance sensor and packaging method of the sameLINGSEN PREC INDUSTRIES LTD·Filed 2017·Granted Aug 27, 2019·0 cites·7 claims
- 0651US9905548B2Optical module integrated packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Feb 27, 2018·0 cites·8 claims
- 0748US10103286B2Packaging method of long-distance sensorLINGSEN PREC INDUSTRIES LTD·Filed 2017·Granted Oct 16, 2018·0 cites·6 claims
- 0844US9952089B2Optical sensing module and method of manufacturing the sameLINGSEN PREC INDUSTRIES LTD·Filed 2014·Granted Apr 24, 2018·0 cites·6 claims
- 0943US2020105636A1Chip package structure having function of preventing adhesive from overflowingLINGSEN PREC INDUSTRIES LTD·Filed 2018·Application pending·0 cites
- 1041US10312169B1Substrate and package module including the sameLINGSEN PREC INDUSTRIES LTD·Filed 2018·Granted Jun 4, 2019·0 cites·6 claims
- 1140US2020109044A1Microelectromechanical microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2018·Application pending·0 cites
- 1239US10090427B2Package structure of long-distance sensor and packaging method of the sameLINGSEN PREC INDUSTRIES LTD·Filed 2017·Granted Oct 2, 2018·0 cites·10 claims
- 1339US10003874B2Microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jun 19, 2018·0 cites·20 claims
- 1435US10362377B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jul 23, 2019·0 cites·18 claims
- 1535US2018190630A1Package structure of optical moduleLINGSEN PREC INDUSTRIES LTD·Filed 2017·Application pending·0 cites
- 1634US10362406B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jul 23, 2019·0 cites·12 claims
- 1734US10299046B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted May 21, 2019·0 cites·5 claims
- 1834US2018063616A1Microelectromechanical microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2016·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →