Assignee
LIU AN HONG
TW·1 granted patent·4 pending applications·0 citations·filing 2005–2012
Top patents by PatentIndex Score
5 records- 0147US8338935B2Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the sameLIU AN HONG·Filed 2011·Granted Dec 25, 2012·0 cites·19 claims
- 0234US2006022317A1Chip-under-tape package structure and manufacture thereofLIU AN-HONG·Filed 2005·Application pending·0 cites
- 0334US2013119530A1Thermally enhanced packaging structureLIU AN HONG·Filed 2012·Application pending·0 cites
- 0433US2012299036A1Thermally enhanced light emitting device packageLIU AN HONG·Filed 2011·Application pending·0 cites
- 0532US2013069228A1Flip-chip package structure and forming method thereofLIU AN-HONG·Filed 2012·Application pending·0 cites
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