Assignee
LO WAI YEW
MY·9 granted patents·9 pending applications·37 citations·filing 2006–2014
Top patents by PatentIndex Score
18 records- 0193US8378435B2Pressure sensor and method of assembling sameLO WAI YEW·Filed 2010·Granted Feb 19, 2013·16 cites·20 claims
- 0286US9297713B2Pressure sensor device with through silicon viaLO WAI YEW·Filed 2014·Granted Mar 29, 2016·8 cites·10 claims
- 0380US9362479B2Package-in-package semiconductor sensor deviceLO WAI YEW·Filed 2014·Granted Jun 7, 2016·5 cites·7 claims
- 0477US8941194B1Pressure sensor device having bump chip carrier (BCC)LO WAI YEW·Filed 2013·Granted Jan 27, 2015·4 cites·10 claims
- 0569US9029999B2Semiconductor sensor device with footed lidLO WAI YEW·Filed 2011·Granted May 12, 2015·2 cites·8 claims
- 0660US8283780B2Surface mount semiconductor deviceLO WAI YEW·Filed 2010·Granted Oct 9, 2012·2 cites·7 claims
- 0748US9638596B2Cavity-down pressure sensor deviceLO WAI YEW·Filed 2014·Granted May 2, 2017·0 cites·12 claims
- 0847US8546169B1Pressure sensor device and method of assembling sameLO WAI YEW·Filed 2012·Granted Oct 1, 2013·0 cites·10 claims
- 0945US2016069763A1Semiconductor sensor device formed with gel sheetLO WAI YEW·Filed 2014·Application pending·0 cites
- 1044US2015340305A1Stacked die package with redistribution layerLO WAI YEW·Filed 2014·Application pending·0 cites
- 1143US2015162269A1Semiconductor die package with insulated wires for routing power signalsLO WAI YEW·Filed 2013·Application pending·0 cites
- 1243US2014374855A1Pressure sensor and method of packaging sameLO WAI YEW·Filed 2013·Application pending·0 cites
- 1342US2007281397A1Method of forming semiconductor packaged deviceLO WAI YEW·Filed 2006·Application pending·0 cites
- 1442US2015069537A1Package-on-package semiconductor sensor deviceLO WAI YEW·Filed 2013·Application pending·0 cites
- 1539US8460972B2Method of forming semiconductor packageLO WAI YEW·Filed 2010·Granted Jun 11, 2013·0 cites·7 claims
- 1639US2012139067A1Pressure sensor and method of packaging sameLO WAI YEW·Filed 2011·Application pending·0 cites
- 1739US2012306031A1Semiconductor sensor device and method of packaging sameLO WAI YEW·Filed 2011·Application pending·0 cites
- 1834US2012073859A1Polymer core wireLO WAI YEW·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →