Assignee

LOO KUM WENG

SG·1 granted patent·5 citations·filing 2010–2010

Technology mixH10W1

Top patents by PatentIndex Score

1 record

0171US8338943B2Semiconductor package with thermal heat spreaderLOO KUM WENG·Filed 2010·Granted Dec 25, 2012·5 cites·26 claims

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