Assignee
LOW BOON YEW
MY·7 granted patents·2 pending applications·17 citations·filing 2010–2015
Top patents by PatentIndex Score
9 records- 0189US8338236B1Vented substrate for semiconductor deviceLOW BOON YEW·Filed 2011·Granted Dec 25, 2012·12 cites·4 claims
- 0273US9418929B1Integrated circuit with sewn interconnectsLOW BOON YEW·Filed 2015·Granted Aug 16, 2016·3 cites·18 claims
- 0362US8698288B1Flexible substrate with crimping interconnectionLOW BOON YEW·Filed 2013·Granted Apr 15, 2014·2 cites·16 claims
- 0444US8643189B1Packaged semiconductor die with power rail padsLOW BOON YEW·Filed 2012·Granted Feb 4, 2014·0 cites·20 claims
- 0542US9165862B1Semiconductor device with plated through holesLOW BOON YEW·Filed 2014·Granted Oct 20, 2015·0 cites·16 claims
- 0642US2014374891A1Semiconductor device with heat spreader and thermal sheetLOW BOON YEW·Filed 2013·Application pending·0 cites
- 0740US2015118802A1Dual corner top gate moldingLOW BOON YEW·Filed 2014·Application pending·0 cites
- 0839US8338828B2Semiconductor package and method of testing sameLOW BOON YEW·Filed 2010·Granted Dec 25, 2012·0 cites·10 claims
- 0934US9351407B1Method for forming multilayer device having solder filled via connectionLOW BOON YEW·Filed 2015·Granted May 24, 2016·0 cites·5 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →