Assignee
LOW JEFFREY KHAI HUAT
MY·2 granted patents·4 citations·filing 2005–2012
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0156US8334583B2Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic componentLOW JEFFREY KHAI HUAT·Filed 2005·Granted Dec 18, 2012·3 cites·10 claims
- 0251US8497158B2Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic componentLOW JEFFREY KHAI HUAT·Filed 2012·Granted Jul 30, 2013·1 cites·8 claims
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