Assignee
LU SU-TSAI
TW·3 granted patents·19 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0188US9184153B2Chip stack structure and method for fabricating the sameLU SU-TSAI·Filed 2012·Granted Nov 10, 2015·15 cites·16 claims
- 0265US8227915B2Bump structure, chip package structure including the same and method of manufacturing the sameLU SU TSAI·Filed 2009·Granted Jul 24, 2012·3 cites·13 claims
- 0355US8604613B2Electronic assembly having a multilayer adhesive structureLU SU-TSAI·Filed 2008·Granted Dec 10, 2013·1 cites·14 claims
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