Assignee
LUO JUNHUA
CN·4 granted patents·1 pending application·0 citations·filing 2011–2014
Top patents by PatentIndex Score
5 records- 0146US8722465B1Method of assembling semiconductor device including insulating substrate and heat sinkLUO JUNHUA·Filed 2014·Granted May 13, 2014·0 cites·10 claims
- 0244US8643170B2Method of assembling semiconductor device including insulating substrate and heat sinkLUO JUNHUA·Filed 2012·Granted Feb 4, 2014·0 cites·6 claims
- 0339US8859336B2Method of packaging semiconductor die with cap elementLUO JUNHUA·Filed 2012·Granted Oct 14, 2014·0 cites·16 claims
- 0439US2014284806A1Semiconductor device die attachmentLUO JUNHUA·Filed 2014·Application pending·0 cites
- 0537US8481369B2Method of making semiconductor package with improved standoffLUO JUNHUA·Filed 2011·Granted Jul 9, 2013·0 cites·10 claims
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