Assignee
MACDERMID ENTHONE INC
US·34 granted patents·23 pending applications·12 citations·filing 2014–2025
Top patents by PatentIndex Score
57 records- 0185US10443135B1Near neutral pH pickle on multi-metalsMACDERMID ENTHONE INC·Filed 2018·Granted Oct 15, 2019·4 cites·23 claims
- 0284US11384446B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2020·Granted Jul 12, 2022·1 cites·12 claims
- 0383US2024158941A1Gold Plating Bath and Gold Plated Final FinishMACDERMID ENTHONE INC·Filed 2024·Application pending·0 cites
- 0482US2024110306A1Compositions and Methods for the Electrodeposition of Nanotwinned CopperMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 0580US11873568B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Granted Jan 16, 2024·0 cites·15 claims
- 0680US11035048B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2017·Granted Jun 15, 2021·3 cites·30 claims
- 0777US11697884B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 0876US10544516B2Flexible color adjustment for dark Cr(III) platingsMACDERMID ENTHONE INC·Filed 2016·Granted Jan 28, 2020·1 cites·21 claims
- 0976US10519557B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2017·Granted Dec 31, 2019·2 cites·28 claims
- 1075US12540404B2Method for improving adhesion between metallization layers and ozone-etched plasticsMACDERMID ENTHONE INC·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 1173US12157944B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2023·Granted Dec 3, 2024·0 cites·37 claims
- 1270US11434578B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Sep 6, 2022·0 cites·28 claims
- 1369US12398480B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 26, 2025·0 cites·15 claims
- 1469US2024018678A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 1568US2025243596A1Composition and Method for Fabrication of Nickel InterconnectsMACDERMID ENTHONE INC·Filed 2025·Application pending·0 cites
- 1667US11643742B2Silver/tin electroplating bath and method of using the sameMACDERMID ENTHONE INC·Filed 2022·Granted May 9, 2023·0 cites·18 claims
- 1766US11846018B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2022·Granted Dec 19, 2023·0 cites·9 claims
- 1866US11401618B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 2, 2022·0 cites·31 claims
- 1966US10986738B2Carbon-based direct plating processMACDERMID ENTHONE INC·Filed 2018·Granted Apr 20, 2021·0 cites·16 claims
- 2065US10941496B2Near neutral pH pickle on multi-metalsMACDERMID ENTHONE INC·Filed 2019·Granted Mar 9, 2021·0 cites·10 claims
- 2165US2021371998A1Gold Plating Bath and Gold Plated Final FinishMACDERMID ENTHONE INC·Filed 2020·Application pending·0 cites
- 2264US12553134B2Bendable nickel plating on flexible substratesMACDERMID ENTHONE INC·Filed 2023·Granted Feb 17, 2026·0 cites·23 claims
- 2364US2021204412A1Carbon-Based Direct Plating ProcessMACDERMID ENTHONE INC·Filed 2021·Application pending·0 cites
- 2463US11280014B2Silver/tin electroplating bath and method of using the sameMACDERMID ENTHONE INC·Filed 2020·Granted Mar 22, 2022·0 cites·18 claims
- 2563US10995417B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted May 4, 2021·0 cites·20 claims
- 2663US10103029B2Process for filling vias in the microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted Oct 16, 2018·1 cites·27 claims
- 2763US2025137156A1Boric acid-free satin nickelMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 2863US2025188349A1Suppression of manganese dioxide formation in manganese (iii)-based etching solutionsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 2961US2026078517A1Composition and method for nanotwinned copper formationMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 3060US11807951B2Cobalt chemistry for smooth topologyMACDERMID ENTHONE INC·Filed 2021·Granted Nov 7, 2023·0 cites·16 claims
- 3159US11168406B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2019·Granted Nov 9, 2021·0 cites·31 claims
- 3257US12270121B2Composition and method for fabrication of nickel interconnectsMACDERMID ENTHONE INC·Filed 2020·Granted Apr 8, 2025·0 cites·19 claims
- 3357US10081876B2Aqueous electrolyte composition having a reduced airborne emission, method and use of this compositionMACDERMID ENTHONE INC·Filed 2014·Granted Sep 25, 2018·0 cites·25 claims
- 3456USRE49202ECopper electrodeposition in microelectronicsMACDERMID ENTHONE INC·Filed 2018·Granted Sep 6, 2022·0 cites·69 claims
- 3555US11230778B2Cobalt chemistry for smooth topologyMACDERMID ENTHONE INC·Filed 2019·Granted Jan 25, 2022·0 cites·21 claims
- 3654US2025137140A1Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor devicesMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 3754US2022081776A1High Elongation Electroless Copper ProcessMACDERMID ENTHONE INC·Filed 2020·Application pending·0 cites
- 3852US12325927B2Complex waveform for electrolytic platingMACDERMID ENTHONE INC·Filed 2022·Granted Jun 10, 2025·0 cites·24 claims
- 3950US11124888B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2017·Granted Sep 21, 2021·0 cites·17 claims
- 4049US2024318342A1Compositions and methods for the eletrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Application pending·0 cites
- 4148US2019390356A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 4247US10508207B2Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrateMACDERMID ENTHONE INC·Filed 2016·Granted Dec 17, 2019·0 cites·23 claims
- 4347US2017350016A1Use of Water Soluble Lanthanide Compounds As Stabilizer In Electrolytes For Electroless Metal DepositionMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 4445US2023335496A1Process for Fabricating a 3D-NAND Flash MemoryMACDERMID ENTHONE INC·Filed 2021·Application pending·0 cites
- 4544US2019085461A1Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal depositionMACDERMID ENTHONE INC·Filed 2016·Application pending·0 cites
- 4643US11015255B2Selective plating of three dimensional surfaces to produce decorative and functional effectsMACDERMID ENTHONE INC·Filed 2018·Granted May 25, 2021·0 cites·20 claims
- 4743US2019112713A1Compressively Stressed Medium Phosphorus Electroless NickelMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 4842US10828668B2Textured hardcoat filmsMACDERMID ENTHONE INC·Filed 2017·Granted Nov 10, 2020·0 cites·12 claims
- 4942US2018245178A1System and Method for Recovering Catalytic Precious Metal from Aqueous Galvanic Processing SolutionMACDERMID ENTHONE INC·Filed 2016·Application pending·0 cites
- 5041US2025051927A1Method of Metallization by a Nickel or Cobalt Alloy for the Manufacture of Semiconductor DevicesMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →