Assignee
MACDERMID INC
US·136 granted patents·6 pending applications·4,042 citations·filing 1973–2022
Top patents by PatentIndex Score
142 records- 0197US5147692AElectroless plating of nickel onto surfaces such as copper or fused tungstonMACDERMID INC·Filed 1991·Granted Sep 15, 1992·287 cites·18 claims
- 0296US5869130AProcess for improving the adhesion of polymeric materials to metal surfacesMACDERMID INC·Filed 1997·Granted Feb 9, 1999·149 cites·20 claims
- 0396US4265943AMethod and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ionsMACDERMID INC·Filed 1978·Granted May 5, 1981·338 cites·18 claims
- 0494US5641608ADirect imaging process for forming resist pattern on a surface and use thereof in fabricating printing platesMACDERMID INC·Filed 1995·Granted Jun 24, 1997·167 cites·22 claims
- 0592US4944851AElectrolytic method for regenerating tin or tin-lead alloy stripping compositionsMACDERMID INC·Filed 1989·Granted Jul 31, 1990·55 cites·14 claims
- 0692US4209331AElectroless copper composition solution using a hypophosphite reducing agentMACDERMID INC·Filed 1978·Granted Jun 24, 1980·49 cites·20 claims
- 0791US5160579AProcess for manufacturing printed circuit employing selective provision of solderable coatingMACDERMID INC·Filed 1991·Granted Nov 3, 1992·86 cites·9 claims
- 0891US5017267AComposition and method for stripping tin or tin-lead alloy from copper surfacesMACDERMID INC·Filed 1990·Granted May 21, 1991·46 cites·22 claims
- 0990US4279948AElectroless copper deposition solution using a hypophosphite reducing agentMACDERMID INC·Filed 1979·Granted Jul 21, 1981·44 cites·15 claims
- 1088US6281090B1Method for the manufacture of printed circuit boards with plated resistorsMACDERMID INC·Filed 2000·Granted Aug 28, 2001·69 cites·28 claims
- 1187US4409037AAdhesion promoter for printed circuitsMACDERMID INC·Filed 1982·Granted Oct 11, 1983·70 cites·13 claims
- 1286US5747098AProcess for the manufacture of printed circuit boardsMACDERMID INC·Filed 1996·Granted May 5, 1998·61 cites·11 claims
- 1386US5733599AMethod for enhancing the solderability of a surfaceMACDERMID INC·Filed 1996·Granted Mar 31, 1998·53 cites·8 claims
- 1486US4804615AMethod for manufacture of printed circuit boardsMACDERMID INC·Filed 1986·Granted Feb 14, 1989·60 cites·12 claims
- 1586US4603058APost-treatment of cured, radiation sensitive, polymerizable resins to eliminate surface tackMACDERMID INC·Filed 1984·Granted Jul 29, 1986·36 cites·23 claims
- 1685US5935640AMethod for enhancing the solderability of a surfaceMACDERMID INC·Filed 1997·Granted Aug 10, 1999·46 cites·5 claims
- 1785US4976990AProcess for metallizing non-conductive substratesMACDERMID INC·Filed 1989·Granted Dec 11, 1990·65 cites·14 claims
- 1885US3982045AMethod of manufacture of additive printed circuitboards using permanent resist maskMACDERMID INC·Filed 1974·Granted Sep 21, 1976·30 cites·6 claims
- 1984US4863758ACatalyst solutions for activating non-conductive substrates and electroless plating processMACDERMID INC·Filed 1987·Granted Sep 5, 1989·52 cites·6 claims
- 2083US5296334ARadiation-curable composition useful for preparation of solder masksMACDERMID INC·Filed 1992·Granted Mar 22, 1994·48 cites·20 claims
- 2183US5288377AProcess for the manufacture of printed circuits using electrophoretically deposited organic resistsMACDERMID INC·Filed 1993·Granted Feb 22, 1994·35 cites·11 claims
- 2283US4775444AProcess for fabricating multilayer circuit boardsMACDERMID INC·Filed 1987·Granted Oct 4, 1988·46 cites·14 claims
- 2382US6197459B1Photosensitive resin composition useful in fabricating printing platesMACDERMID INC·Filed 2000·Granted Mar 6, 2001·19 cites·10 claims
- 2482US5965460APolyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing padsMACDERMID INC·Filed 1997·Granted Oct 12, 1999·42 cites·16 claims
- 2582US4921571AInhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfacesMACDERMID INC·Filed 1989·Granted May 1, 1990·42 cites·17 claims
- 2682US3959523AAdditive printed circuit boards and method of manufactureMACDERMID INC·Filed 1973·Granted May 25, 1976·30 cites·6 claims
- 2781US4931148AMethod for manufacture of printed circuit boardsMACDERMID INC·Filed 1988·Granted Jun 5, 1990·46 cites·9 claims
- 2881US4849059AAqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent thereforMACDERMID INC·Filed 1988·Granted Jul 18, 1989·27 cites·11 claims
- 2981US4608275AOxidizing acceleratorMACDERMID INC·Filed 1985·Granted Aug 26, 1986·43 cites·14 claims
- 3080US4844981AAdhesion promoter for printed circuitsMACDERMID INC·Filed 1987·Granted Jul 4, 1989·52 cites·4 claims
- 3180US4110147AProcess of preparing thermoset resin substrates to improve adherence of electrolessly plated metal depositsMACDERMID INC·Filed 1977·Granted Aug 29, 1978·35 cites·5 claims
- 3280US3978252AMethod of improving the adhesion between a molded resin substrate and a metal film deposited thereonMACDERMID INC·Filed 1975·Granted Aug 31, 1976·30 cites·11 claims
- 3379US6146701AProcess for improving the adhension of polymeric materials to metal surfacesMACDERMID INC·Filed 1999·Granted Nov 14, 2000·45 cites·13 claims
- 3479US4784785ACopper etchant compositionsMACDERMID INC·Filed 1987·Granted Nov 15, 1988·23 cites·32 claims
- 3579US4748104ASelective metallization process and additive method for manufactured printed circuit boardsMACDERMID INC·Filed 1986·Granted May 31, 1988·26 cites·18 claims
- 3679US4600609AMethod and composition for electroless nickel depositionMACDERMID INC·Filed 1985·Granted Jul 15, 1986·50 cites·29 claims
- 3779US4597988AProcess for preparing printed circuit board thru-holesMACDERMID INC·Filed 1985·Granted Jul 1, 1986·40 cites·12 claims
- 3878US6200451B1Method for enhancing the solderability of a surfaceMACDERMID INC·Filed 1999·Granted Mar 13, 2001·39 cites·12 claims
- 3978US4096301AApparatus and method for automatically maintaining an electroless copper plating bathMACDERMID INC·Filed 1976·Granted Jun 20, 1978·37 cites·10 claims
- 4076US5759378AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1997·Granted Jun 2, 1998·32 cites·16 claims
- 4175US5248398AProcess for direct electrolytic regeneration of chloride-based ammoniacal copper etchant bathMACDERMID INC·Filed 1990·Granted Sep 28, 1993·26 cites·10 claims
- 4275US4701390AThermally stabilized photoresist imagesMACDERMID INC·Filed 1985·Granted Oct 20, 1987·28 cites·15 claims
- 4374US6162503AProcess for improving the adhesion of polymeric materials to metal surfacesMACDERMID INC·Filed 1999·Granted Dec 19, 2000·37 cites·16 claims
- 4474US5814163AComposition and process for cleaning inks form various surfaces including printing platesMACDERMID INC·Filed 1996·Granted Sep 29, 1998·32 cites·19 claims
- 4574US5632927AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1996·Granted May 27, 1997·24 cites·12 claims
- 4673US4831210AShields for electromagnetic radiationMACDERMID INC·Filed 1987·Granted May 16, 1989·29 cites·12 claims
- 4773US4800132AMechanical plating with oxidation-prone metalsMACDERMID INC·Filed 1987·Granted Jan 24, 1989·27 cites·18 claims
- 4873US4687545AProcess for stripping tin or tin-lead alloy from copperMACDERMID INC·Filed 1986·Granted Aug 18, 1987·33 cites·23 claims
- 4972US5536386AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1995·Granted Jul 16, 1996·23 cites·18 claims
- 5072US5468515AComposition and method for selective platingMACDERMID INC·Filed 1994·Granted Nov 21, 1995·31 cites·10 claims
Showing the top 50 of 142 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when MACDERMID INC files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →